• Electronics Surface Finish Overview - SMTA

    Nickel incompatibility is a particular problem, since nickel is used in numerous applications. Contaminants. Electroless gold is compatible with silicon. However the solution actively attacks aluminum because of the high alkalinity. Some organics can also cause problems in the electroless gold bath. Polyethylene inhibits plating.

  • What Is Porosity in Electroplating? - Sharretts Plating ...

    In many applications, the electroplated surface of a product needs to be smooth and consistent to ensure proper functionality. In the telecommunications industry, especially, imperfections on the surface of a connector can lead to electrical resistance and poor performance. Modern electroplating methods allow for the production of high-quality finished parts. However, a range of variables …

  • The Plating Forum: ENIG and the Plating Process

    Key areas examined were electroless nickel (E-Ni) surface morphology, phosphorous content of the nickel and the thickness of the deposit. The process interactions of the immersion gold are equally as important as the nickels. They are greatly influenced by the quality of the underlying nickel.

  • Affinity ENEPIG | Plating Process Final Finishes ...

    Electroless nickel immersion gold (ENIG) is a type of surface plating used for printed circuit boards.It consists of an electroless nickel plating covered with a thin layer of immersion gold, which protects the nickel from oxidation.. ENIG has several advantages over more conventional (and cheaper) surface platings such as HASL (solder), including excellent surface planarity (particularly ...

  • Electroless plating process/Electroless deposition ...

    Electro less Nickel/Immersion Gold (ENIG) is a double-layer metallic surface finish that is composed of a very thin layer of gold, applied over a layer of nickel. A nickel layer is first plated onto the PCB copper pads using an electroless process: a controlled chemical reaction.

  • Electroless Ni / Pd / Au Plating (ENEPIG)

    Dec 09, 2018· Describes the electroless plating process (electroless plating of Nickel over copper), mechanism and reactions. Advantages of electroless plating over electroplating. Applications. It describes ...

  • PCB Process: ENAG - Electroless Nickel Autocatalytic Gold ...

    When electroless nickel and gold (ENIG) plating aluminum, a zincation process is used to activate the exposed aluminum before the nickel is deposited. The aluminum oxide layer is removed and the surface is activated through zinc displacement plating using

  • Electroless nickel plating - Wikipedia

    The process is qualified and in mass production for the world’s leading cellular phone fabricators. AuNic ®: A drop-in process for existing standard ENIG lines. It consists of five main steps: cleaning, micro-etch, activation, electroless nickel and immersion Gold.

  • ARE YOU IN CONTROL OF YOUR ELECTROLESS NICKEL/IMMERSION ...

    The difficulty of an electroless nickel / immersion gold process is in its complexity. The multiple pre-treatment steps, plating steps and process control levers to consider are the reason why ENIG has been a historically difficult process to handle.

  • Problems & Solutions in ENIG (Electroless nickel ...

    Bright Electroless Gold. A gold plating solution for depositing thin, uniform layers of 24 karat gold by an electroless immersion process – for printed circuit boards, transistor headers, electrical connectors, diode leads, lamps and other electronic parts.

  • Final finishing | Atotech

    The electroless nickel immersion gold (ENIG) process has been widely used in the microelectronics packaging industry as a surface finish for solder pads. The ENIG film has good electrical conductivity, solder wettability and corrosion resistance , , , . However, the film is susceptible to a critical bonding failure problem, named the “black ...

  • A corrosion couple experiment reproducing the black pad ...

    Electroless Nickel / Autocatalytic Gold (ENAG) ENAG is a high-performing final finish for wire bondable deposits, and an excellent alternative to immersion chemistry, or ENEPIG. It deposits 120-240 μins of nickel, 8-40 μins of electroless gold. Read “Neutral Auto-Catalytic Electroless Gold Plating Process” in the Uyemura library.

  • Some Information on Electroless Gold Plating | Products ...

    Problems & Solutions in ENIG (Electroless nickel / immersion gold) and ENAG Plating. A discussion started in 1996 but continuing through 2020. 1996. Q. I am looking for a brief description of processing and potential problems for immersion nickel and immersion gold.

  • Selective Electroless Nickel and Gold Plating of ...

    immersion Au deposition process and minimizing any detrimental interactions with the electroless nickel layer. The electroless nickel and immersion gold layers are deposited using a series of wet chemical baths. The wafers are first immersed in chemicals that clean the bond pads of any impurities and then in chemicals that activate the pad

  • Electroless Nickel/Immersion Silver—A New Surface Finish ...

    ENIG - Electroless Nickel Immersion Gold is a reduction-assisted immersion process that deposits higher thicknesses, in a single step. ENIG deposits have a tighter, more uniform grain and maintains high solderability, while also resisting corrosion.

  • Palladium deactivation pretreatment process for ...

    Electroless nickel - immersion gold Electroless nickel – immersion gold (ENIG) is a flat, solderable, metallic finish on printed circuit boards and ceramic substrates. It serves to protect the copper from oxidation and ensures solde - rability and bondability with aluminium wire. In this process, the surfaces and vias intended for the finish ...

  • Umicore - Umicore Electroplating - ENIG process

    Aurolectroless™ SMT-520 Immersion Gold is the latest final finish product from DuPont Electronic Solutions. Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance. The product delivers uniform, fine-grained deposits of pure gold on substrates including electroless nickel and palladium.

  • Electro-less Nickel, Immersion Gold (ENIG)

    Electronics Surface Finish Overview SMTA Upper Midwest Expo Robyn J Hanson MacDermid June 25, 2015. ... Immersion Silver Process • Process Steps: Cleaner Rinse Microetch Rinse Predip Immersion Silver Rinse and dry ... Electroless Nickel Rinse Immersion Gold Rinse p.40. ENIG: Pros and Cons

  • Electroless nickel immersion gold - Wikipedia

    Immersion gold plating vs. electroless gold plating 2002. Q. Is there a substantive difference between electroless gold and immersion gold, and if so can you define this for me. I am not a finishing professional but I deal with components that mount to printed circuit boards. Roger Williams - Missouri

  • Immersion Vs. Autocatalytic Gold Plating | Products Finishing

    Electroless nickel plating (or EN plating) is a chemical process that deposits an even layer of nickel-phosphorus or nickel-boron alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a suitable reducing agent.

  • ELECTROLESS NICKEL - IMMERSION GOLD

    The electroless palladium layer forms a diffusion barrier that impedes nickel diffusion to the gold surface and, in turn, the immersion gold protects the palladium layer from reacting with contaminants prior to processing that might otherwise affect joining processes, such as wire bonding and soldering. Recommended Drawing Call-Out

  • Immersion gold plating vs. electroless gold plating

    ENIG process Electroless nickel - immersion gold. Electroless nickel – immersion gold (ENIG) is a flat, solderable, metallic finish on printed circuit boards and ceramic substrates. It serves to protect the copper from oxidation and ensures solderability and bondability with aluminium wire.

  • Electroless Nickel Immersion Gold Process

    Immersion Gold CF is a two part system suitable for producing thin gold films on metal surfaces via an electroless immersion process. The cyanide-free formulation offers reduced toxicity and improved compatibility vs. cyanide formulations. Immersion Gold CF takes advantage of EMF potential differences to plate gold films with good adhesion.

  • Surface Finishes: Why do I need to know more?

    Cyanide immersion gold process operating on a completely novel mechanism of gold reduction in the presence of nickel and TechniPad Au 6100 additive. Ni is not removed from the substrate eliminating all of the corrosion associated with black pad and hyper corrosion found in a typical cyanide based immersion gold process.

  • Electroless immersion gold process | Transene

    Process Flow Clean Microetch Predip Apply Tin Postdip Typically Processed in Production Panel Form . 8 ... Electroless Nickel Immersion Gold *IMPORTANT - The gold serves as a barrier and protectant to the nickel. The gold will dissolve into the solder during assembly. Gold thicknesses over4 micro inches can cause solderability issues.

  • Electroless Nickel | Immersion Gold | MacDermid Enthone ...

    Reliability & Performance From a Single Surface Finish. MacDermid Enthone’s Affinity ENEPIG is the latest electroless nickel/electroless palladium/immersion gold plating process designed specifically to deliver a high reliability wire bondabale surface finish with high yields.

  • Duraposit™ Electroless Nickel | Aurolectroless™ Immersion Gold

    Jan 07, 2014· The Plating Forum: ENIG and the Plating Process ... Electroless nickel immersion gold (ENIG) continues to gain market share due to its versatility in a wide range of component assembly methods including solder fusing, wave soldering, and wire bonding. The ENIG finish provides a highly solderable flat surface that does not tarnish or discolor ...

  • ENIG & ENEPIG Plating Processes | Technic Inc.

    Page 1 of 1 Revision: 073109 Product: ENIG Process Flow Electroless Nickel Immersion Gold Process # PROCESS STEP TEMPERATURE DWELL TIME 1 ENIG PC300 Cleaner Alternately: CK300 Cleaner 90 – 120 F (120) 32 – 49 C (49) 3 – 5 min (4) 2 DI water rinses 2x counterflow Room temp. 1 - …

  • The Electrochemical Effects of Immersion Gold on ...

    Electroless nickel/immersion gold (ENIG) has been the primary, high-performance surface finish used in the PCB industry for some decades now. Market research confirms that in terms of processed surface area per year, ENIG useage is second only to organic solderability preservatives (OSP) [].ENIG is typically described as a surface finish which is labor intensive to work with at the fabrication ...

  • IPC-4556 -ENEPIG Plating for PCB

    Dec 04, 2012· The gold deposit is much thicker than that obtained from an immersion plating process, and it’s adherence to the substrate is much better. Autocatalytic gold solutions are relatively new in the world of metal finishing. The granddaddy of these solutions is the electroless nickel plating solutions that are fairly well-known and understood.